Nano-tube MOSFET technology and devices

ABSTRACT

This invention discloses a semiconductor power device disposed in a semiconductor substrate and the semiconductor substrate has a plurality of trenches. Each of the trenches is filled with a plurality of epitaxial layers of alternating conductivity types constituting nano tubes functioning as conducting channels stacked as layers extending along a sidewall direction with a “Gap Filler” layer filling a merging-gap between the nano tubes disposed substantially at a center of each of the trenches. The “Gap Filler” layer can be very lightly doped Silicon or grown and deposited dielectric layer. In an exemplary embodiment, the plurality of trenches are separated by pillar columns each having a width approximately half to one-third of a width of the trenches.

This Patent Application is a Divisional Application of application Ser.No. 12/319,164 filed on Dec. 31, 2008 now U.S. Pat. No. 7,943,989. TheDisclosures made in the patent application Ser. No. 12/319,164 arehereby incorporated by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to the semiconductor power devices. Moreparticularly, this invention relates to configurations and methodsimplemented with alternating doped nano-tubes for manufacturing flexiblyscalable charge balanced semiconductor power devices with simplemanufacturing processes with improved breakdown voltage andsignificantly reduced resistance.

2. Description of the Prior Art

Semiconductor devices including metal oxide semiconductor field effecttransistor (MOSFET) devices configured with vertical super junctionstructure and electrical characteristics are known and have beendisclosed in many patented disclosures. The patented disclosures includeU.S. Pat. Nos. 5,438,215, 5,216,275, 4,754,310, 6,828,631. Fujihirafurther discloses configurations of the vertical super junction devicesin the publication “Theory of Semiconductor Super Junction Devices”(Japan Journal of Applied Physics Vol. 36, October 1979 PP238-241).Specifically, FIG. 1C shows a vertical trench MOSFET super junctiondevice published by Fujihira (FIG. 2A in Fujihira's paper). Fujihiraalso disclosed in U.S. Pat. No. 6,097,063 a vertical semiconductordevice has a drift region in which a drift current flows if it is in theON mode and which is depleted if it is in the OFF mode. The drift regionis formed as a structure having a plurality of first conductive typedivided drift regions and a plurality of second conductive typecompartment regions in which each of the compartment regions ispositioned among the adjacent drift regions in parallel to make p-njunctions, respectively. In U.S. Pat. No. 6,608,350 discloses a verticalsuper junction device implemented with layers of a dielectric materialto fill in the trenches. However, as further discussed below, theconfigurations and operational characteristics of these super junctiondevices as disclosed still encounter technical limitations thusrestricting the practical usefulness of these devices.

Specifically, conventional manufacturing technologies and deviceconfiguration to further increase the breakdown voltage with reducedseries resistance, including the devices implemented with super junctionstructures, are still confronted with manufacturability difficulties.The practical applications and usefulness of the high voltagesemiconductor power devices are limited due to the facts that theconventional high power devices generally have structural features thatrequire numerous time-consuming, complex, and expensive manufacturingprocesses. More particularly, some of the processes for manufacturingthe high voltage power devices are complicated thus having lowthroughput and low yields.

In comparison to conventional technologies, the super-junctiontechnologies have advantages to achieve higher breakdown voltage (BV)without unduly increasing the drain-to-source resistance, Rdson. Forstandard power transistor cells, breakdown voltage is supported largelyon the low-doped drift layer. Therefore, the drift layer is made withgreater thickness and with relatively low doping concentration toachieve higher voltage ratings. However this also has the effect ofgreatly increasing the Rdson resistance. In the conventional powerdevices, the resistance Rdson has approximately a functionalrelationship represented by:RdsonαBV^(2.5)

In contrast, a device having a super-junction configuration isimplemented with a charge balanced drift region. The resistance Rdsonhas a more favorable functional relationship with the breakdown voltage.The functional relationship can be represented as:RdsonαBV

For high voltage applications, it is therefore desirable to improve thedevice performance by designing and manufacturing the semiconductorpower devices with super-junction configurations for reducing theresistance Rdson while achieving high breakdown voltage. Regionsadjacent to the channel within the drift region are formed with anopposite conductivity type. The drift region may be relatively highlydoped, so long as the regions adjacent to the channel are similarlydoped but of an opposite conductivity type. During the off state, thecharges of the two regions balance out such that the drift regionbecomes depleted, and can support a high voltage. This is referred to asthe super-junction effect. During the on state, the drift region has alower resistance Rdson because of a higher doping concentration. Studieshave shown that a dopant concentration of 1E12/cm² is optimal for thedrift region of a super junction device.

However, conventional super-junction technologies still have technicallimitations and difficulties when implemented to manufacture the powerdevices. Furthermore, the manufacturing processes often requireequipment not compatible with standard foundry processes. Additionally,these devices have structural features and manufacturing processes notconducive to scalability for low to high voltage applications. In otherwords, some approaches would become too costly and/or too lengthy to beapplied to higher voltage ratings. Also in the prior art devices, it isdifficult to manufacture thin vertical channels for the superjunctionregions. As will be further reviewed and discussions below, theseconventional devices with different structural features and manufacturedby various processing methods, each has limitations and difficultiesthat hinder practical applications of these devices as now demanded inthe marketplace.

There are three basic types of semiconductor power device structures forhigh voltage applications. The first type includes those device formedwith standard structures as depicted in FIG. 1A for a standard VDMOSthat do not incorporate the functional feature of charge balance. Forthis reason, there is no breakdown voltage enhancement beyond theone-dimensional theoretical figure of merit, i.e., the Johnson limit,according to the I-V performance measurements and further confirmed bysimulation analyses of this type of devices. The devices with thisstructure generally have relatively high on-resistance due to the lowdrain drift region doping concentration in order to satisfy the highbreakdown voltage requirement. In order to reduce the on resistanceRdson, this type of devices generally requires large die size. Despitethe advantages that the devices can be manufactured with simpleprocesses and low manufacturing cost, these devices are however notfeasible for high current low resistance applications in the standardpackages due the above discussed drawbacks: the die cost becomesprohibitive (because there are too few dies per wafer) and it becomesimpossible to fit the larger die in the standard accepted packages.

The second type of devices includes structures provided withtwo-dimensional charge balance to achieve a breakdown voltage higherthan the Johnson limit for a given resistance, or a lower specificresistance (Rdson*Area product) than the Johnson limit for a givenbreakdown voltage. This type of device structure is generally referredto as devices implemented with the super junction technology. In thesuper junction structure, a charge-balance along a direction parallel tothe current flow in the drift drain region of a vertical device, basedon PN junctions or by field plate techniques as that implemented inoxide bypassed devices to enable a device to achieve a higher breakdownvoltage. The third type of structure involves a three-dimensionalcharge-balance where the coupling is both in the lateral as well as thevertical directions. Since the purpose of this invention is to improvethe structural configurations and manufacturing processes of devicesimplemented with super junction technologies to achieve two-dimensionalcharge balance, the limitations and difficulties of devices with superjunction will be reviewed and discussed below.

FIG. 1B is a cross sectional view of a device with super junction toreduce the specific resistance (Rsp, resistance times active area) ofthe device by increasing the drain dopant concentration in the driftregion while maintaining the specified breakdown voltage. The chargebalance is achieved by providing P-type vertical columns formed in thedrain to result in lateral and complete depletion of the drain at highvoltage to thus pinch off and shield the channel from the high voltagedrain at the N+ substrate. Such technologies have been disclosed inEurope Patent 0053854 (1982), U.S. Pat. No. 4,754,310, specifically inFIG. 13 of that Patent and U.S. Pat. No. 5,216,275. In these previousdisclosures, the vertical super junctions are formed as vertical columnsof N and P type dopant. In vertical DMOS devices, the vertical chargebalance is achieved by a structure with sidewall doping to form one ofthe doped columns as were illustrated in drawings. In addition to dopedcolumns, doped floating islands have been implemented to increase thebreakdown voltage or to reduce the resistance as disclosed by U.S. Pat.No. 4,134,123 and U.S. Pat. No. 6,037,632. Such device structure ofsuper junction still relies on the depletion of the P-regions to shieldthe gate/channel from the drain. The floating island structure islimited by the technical difficulties due to charge storage andswitching issues. It is difficult to form vertical columns ofalternating conductivity types, particularly when the columns are deepand/or when the widths of the columns are small. For super junctiontypes of devices, the manufacturing methods are generally very complex,expensive and require long processing time due to the facts that themethods require multiple steps and several of these steps are slow andhave a low throughput.

Additionally, for vertical super-junction devices (VSJD), themanufacturing processes either have difficulties in etching or fillingthe trenches. Major problems include the requirement to filling thetrenches with epitaxial (epi) layers without void at the interface ofthe epitaxial layers covering the sidewalls are merged at the center ofthe trench. FIG. 1D (FIG. 1 of U.S. Pat. No. 6,608,350) shows the gapfilling difficulties when the sidewalls are substantially 90 degreeswith voids formed when filling up the gaps (FIG. 1D). Furthermore, thecharge balance and the breakdown voltage are very sensitive to thesidewall angles of the trenches. Furthermore, the device performance isdegraded with the wider P and N columns due to multiple epitaxial andboron implants according to the processes of the conventional methods.These manufacturing processes also increase the production costs. Forthese reasons, the conventional structures and manufacture methods arelimited by slow and expensive manufacturing processes and are noteconomical for broad applications.

Therefore, a need still exists in the art of power semiconductor devicedesign and manufacture to provide new device configurations andmanufacturing method in forming the power devices such that the abovediscussed problems and limitations can be resolved.

SUMMARY OF THE PRESENT INVENTION

It is therefore an aspect of the present invention to provide a new andimproved device structure and manufacturing method to form the dopedcolumns in the drift regions for charge balance with simple andconvenient processing steps. The simplified processes are achievedthrough stacking multiple epitaxial layers formed as nano-tubes byetching trenches with larger openings that is about five to ten micronsor more surrounding pillar columns of about three to five microns.Epitaxial layers with varying thicknesses ranging from a few microns toless than one micron are grown with alternating N and P type dopantsconstituting nano tubes to fill the trenches with a central gap lessthan a width set for a particular filling process (about a micron orless for most cases). Then the central gap can be filled with a gapfilling layer which may be insulating such as thermally grown oxide,deposited oxide, deposited dielectric material or intrinsically grown ordeposited silicon (grown silicon is preferred over deposited silicon).The gap-filling dielectric layer may be implemented with a very lightlydoped or undoped dielectric layer. By way of example the gap fill mayhave a dopant concentration equal to or less than 10% of a dopantconcentration of adjacent nano tubes. The remaining gap may be filled ascenter nano tube, but this may be very difficult to accuratelymanufacture, and may throw off the charge balance. Therefore, it isdesirable to implement a gap fill that is much more feasible. Themanufacturing processes are simplified and can be conveniently carriedout with mostly standard fabrication processes using standard processingmodules and equipment. Therefore, the above discussed technicaldifficulties and limitations can be resolved.

Specifically, it is an aspect of the present invention to provide a newand improved device structure and manufacturing method to form aplurality of nano tubes of alternating conductivity types in asubstantially vertical trench with the original epitaxial layer dopedbefore the trench etch and epitaxial filling. The nano tubes and thecolumns are formed with adjustment to the doping concentration toachieve charge balance. The multiple nano tubes have dopingconcentrations of about 2E12/cm² (which may be treated as two halveseach having 1E12/cm²) per nano tube for optimized charge balance. Themultiple nano tubes act as channels (N-type doped nano tubes asconducting channels for N-type devices) in a small area enablesconstruction of low Rds semiconductor power devices.

It is another aspect of the present invention to provide a new andimproved device structure and manufacturing method to form a pluralityof nano tubes of alternating conductivity types in a vertical trenchwith the nano tubes having a thickness of about less than one micron toa few microns. By way of example, every trench can accommodate five totwenty conducting channels (nano tubes). In comparison to theconventional configuration of one conducting channel super-junctionpower device, the nano-tube configuration of this invention can achievefive to ten times resistance reduction than a conventional superjunction device.

It is another aspect of the present invention to provide new andimproved device structure and manufacturing method to form a pluralityof nano tubes of alternating conductivity types in a vertical trench byetching the trenches with sidewalls having a relatively large tilt angle(tilt angle is defined with respect to a vertical line). Usual tiltangle of a Silicon trench is about 1 Degree (89 Degrees if measured withrespect to the plane of the bottom of the trench). By way of example,the tilt angle can be between 5 and 1 Degrees without significantperformance penalty to power semiconductor device performance.

The trench width can be increased from the bottom of the trench towardsthe surface; could have multiple trench widths (variation of Trench stepwidths is from 0.5 to 2 microns steps) thus pillars with differentwidths can be implemented to make filling easier.

A large tilt angle is allowable because the charge balance can beflexibly adjusted by using very lightly doped starting material to etchlarge trenches to form pillars (columns) and adjusting the dopingconcentration of the nano tubes whereby a strict angular requirement ofthe trench sidewalls is no longer necessary. Since the pillars arelightly doped and only contribute a small amount to charge balance, thevarying widths of the pillars will not greatly affect the chargebalance. Also because the tubes are grown, the thickness of each tubewill remain uniform, regardless of the tilt angle. Therefore, a moreconveniently and more economical manufacturing process can beimplemented.

It is another aspect of the present invention to provide new andimproved device structure and manufacturing method to form a pluralityof nano tubes of alternating conductivity types in a vertical trench tofunction as conducting channels thus achieve charge balance. The basicsuper junction structure as disclosed can be implemented to manufacturemany different types of vertical devices including but not limited todevices such as MOSFET, bipolar junction transistor (BJT), diodes,junction field effect transistor (JFET), insulated-gate bipolartransistor (IGBT), etc.

Briefly in a preferred embodiment this invention discloses asemiconductor power device disposed in a semiconductor substrate and thesemiconductor substrate has a plurality of trenches. Each of thetrenches is filled with a plurality of epitaxial layers of alternatingconductivity types constituting nano tubes functioning as conductingchannels stacked as layers extending along a sidewall direction with aninsulating layer filling a merging-gap in each of the trenches. In anexemplary embodiment, the plurality of trenches merging-gap between thenano tubes is disposed substantially at a center of trenches which areseparated by pillar columns each having a width approximately half toone-third of a width of the trenches.

In another exemplary embodiment, the plurality of trenches each having awidth of about ten microns and separated by a pillar column fromadjacent trenches having a width substantially ranging between three tofive microns. In another exemplary embodiment, the plurality of trencheseach having a width of about ten microns and filled with a plurality ofepitaxial layers of alternating conductivity types constituting nanotubes having a layer thickness substantially ranging between about 0.2to 2 microns. In another exemplary embodiment, the semiconductor pillarregion having a depth ranging from 10 to 120 micrometers and theplurality of trenches each having a depth of about 5 to 120 micrometers.By way of example, a ten micron depth might be used to support about a100 volt (V) device, whereas a 120 micron depth might be used to supporta 1200 V device.

In another exemplary embodiment, the semiconductor substrate comprisesan N+ substrate and a bottom region below the nano tubes and pillarscomprising N+ nano tube merger regions merging together the bottoms ofthe nano tubes and connecting them to a bottom substrate region. By wayof example, the nano tube merger regions may be N+ bottom diffusionregions formed by diffusion from the bottom substrate region, or theymay be formed by a top implantation (midway through the growing of thenano tubes) or as a backside implantation after a backside grinding aslater described. In another exemplary embodiment, the plurality oftrenches having sidewalls formed with a slightly tilted angle relativeto a perpendicular direction to a top surface of the semiconductorsubstrate. In another exemplary embodiment, the semiconductor substratecomprising an N+ substrate with a P-type epitaxial layer supported onthe N+ substrate for opening the plurality of trenches therein.

This invention further discloses a method for forming a semiconductorpower device on an N++ semiconductor substrate with lightly doped andthick N- or P-epi layer. The method includes a step of opening aplurality of deep trenches between lightly doped pillars andsubstantially filling the deep trench with alternating N and P dopedmultiple epitaxial layers overflowing and covering a top surface of thesemiconductor substrate with a top epitaxial layer. The remaining gap isfully filled by very lightly doped silicon layer or thermally grownoxide or deposited dielectric layer. This method includes removal ofepitaxial layers down to original Pillar surface by CMP (ChemicalMechanical Polishing) method. After CMP, N layer formed with thicknessfrom 1-2 microns range by ion implantation or epi growth.

This invention further discloses an alternative method for forming asemiconductor power device on a lightly doped single crystal substrate(without an initial epitaxial layer). Trenches and nano tubes are formedon the single crystal substrate as described above, however, the back ofsubstrate is then ground off up to the nano tubes, and then a highlydoped bottom substrate is either implanted or grown on the back side.

These and other objects and advantages of the present invention will nodoubt become obvious to those of ordinary skill in the art after havingread the following detailed description of the preferred embodiment,which is illustrated in the various drawing figures.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1D are cross sectional views for showing conventionalvertical power device configurations.

FIG. 2 is cross sectional view of high voltage power devices with superjunction structure formed with nano tubes in trenches as an exemplaryembodiment of this invention.

FIG. 2-1 shows a cross section for a device with multiple unit cells 101of FIG. 2 repeated one next to another throughout the semiconductor die.

FIG. 2-2 shows a perspective view of a unit cell 101 of FIG. 2 withoutthe P-implant top layer 130.

FIG. 2A shows a perspective view of a unit cell 101 similar to FIG. 2-2without the P-implant top layer 130 and with N-type pillars 110′.

FIG. 2A-1 is a cross section view of the device of FIG. 2A for showingthe conductivity types and the dopant concentrations.

FIG. 2A-2 is a cross section view of an alternative embodiment of theinvention with a center nano tube rather than an insulating gap fill.

FIG. 2B shows a perspective of a device similar to FIG. 2A with an N+type surface layer electrically connected to all the N-type columns.

FIG. 2C is a perspective view of a vertical planar MOSFET formed with aplanar polysilicon gate padded by a gate oxide layer extended along anorientation that is ninety degrees from the P and N type columns.

FIG. 2D shows another exemplary embodiment similar to FIG. 2C exceptthat there is an N-type surface layer electrically connected to all theN-type columns 115-N.

FIG. 2E shows another exemplary embodiment that further includes aSchottky metal disposed on the top surface for contacting all N-columns115-N to form a Schottky diode.

FIG. 2E-1 shows the same embodiment as FIG. 2E, except with the Schottkymetal removed to show the underlying structures.

FIG. 2E-2 is the same as FIG. 2E-1, except that layer 120 in FIG. 2E-2is made from an oxide, rather than lowly doped (intrinsic) silicon.

FIG. 2F shows another embodiment of this invention wherein the devicehas P+ type substrate 105′ with N-type bottom buffer layer 105-B′ andpillar buffer layer 105-C′ beneath the P columns 115-P and N columns115-N and the N-type pillars 110′ to form an IGBT device.

FIG. 2F-1 shows a similar IGBT device as FIG. 2F but one with trenchgates.

FIGS. 2G-2H show additional embodiments in which various devicestructures are formed on the face 111 of FIG. 2A along an orientationthat is ninety degrees from the P and N type columns 115-P and 115-N.

FIG. 2G shows a junction field effect transistor (JFET) as it wouldappear on the plane 111 of FIG. 2A, wherein the device further includesP type gate region, N+ source contact region, and N− region to form aJFET device.

FIG. 2H shows a bipolar junction transistor (BJT) wherein the devicefurther includes an N+ emitter region and a P-type base region to form aBJT device with the substrate functions as the collector.

FIG. 2I shows another exemplary embodiment wherein the device furthercomprises a trench MOSFET formed with a trench polysilicon gate paddedby a gate oxide layer extended along an orientation that is ninetydegrees from the P and N type columns.

FIG. 2J shows another exemplary embodiment similar to FIG. 2I wherein agate pad is formed on top of a field oxide layer.

FIGS. 3A to 3J are cross sectional views and a top view to illustrateprocessing steps of this invention to manufacture high voltage powerdevice of FIG. 2 with super junction structures.

FIG. 4 shows a perspective view of an alternative configuration of aunit cell 301 having charge balanced alternating N and P nano tubessurrounded by N− pillars having an insulating gap filler layer in thecenter, supported on a N++ substrate.

FIG. 4A shows a perspective view of a portion of the active area 390 ofa semiconductor power device 300 using the nano tube unit cell 301configuration of FIG. 4.

FIG. 4A-1 shows a top view of the layout of semiconductor device 300 ofthis invention.

FIG. 4B shows a close-up cross sectional view of a termination area of asemiconductor power device 300 implemented with the vertical nano-tubesstructure as that described in FIG. 4.

FIG. 5 is a cross sectional view to illustrate the entire terminationarea 399 of a semiconductor power device implemented with the nano-tubestructure shown in FIGS. 4 to 4B.

FIG. 6 is cross sectional view of a termination area similar to thatshown in FIG. 5 with alternative field plate design in the finaltermination structure.

FIG. 6A is a cross section view of an alternative termination area 399″configuration.

FIGS. 7A to 7E are a serial of cross sectional views for illustratingalternate manufacturing processes for making a semiconductor powerdevice of this invention.

FIGS. 8A to 8G are a serial of cross sectional views for themanufacturing processes to resolve the difficulties of void formationduring a gap filling process.

FIG. 9A is a top view for showing the closed cell configuration thatincludes a plurality of the nano tube unit cells in an active areadisposed substantially in the middle portion of a semiconductorsubstrate.

FIG. 9B-1 is a top view for showing a first termination ring of thetermination area of a semiconductor device.

FIG. 9B is a top view for showing an alternative, staggered rectangularshape for the unit cells.

FIG. 9C is a top view for showing an alternative, hexagonal shape forthe unit cells.

DETAILED DESCRIPTION OF THE METHOD

Referring to FIG. 2 for a cross sectional view of a unit cell 101 of avertical nano-tube high-voltage (HV) diode device 100 that illustratesthe new concepts including the new structural and manufacturing featuresof this invention. The HV diode device 100 is supported on a heavilydoped N type bottom substrate 105, e.g., an N+ red phosphoroussubstrate, which lies below an N+, nano tube merger region 105-B whichmay be a diffusion bottom region 105-B and an N+ column diffusion region105-C, which may be formed by a diffusion process as will be describedbelow. The HV device further includes a plurality of N-type nano tubesand P-type nano tubes formed as N-type thin epitaxial layers 115-N andP-type thin epitaxial layers 115-P. These nano-tubes are formed asalternating N-epitaxial layers 115-N and P-epitaxial layers 115-Pbetween two P-type pillars 110 as vertical nano-tubes extended from aP-implant top-layer 130 to the bottom N+ region 105-B. The HV nano-tubediode device 100 further includes a gap filler 120—a very lightly dopedsilicon or an oxide (or other dielectric) region—formed substantially inthe center of each unit cell 101, in the middle of the nano tubes. Thenano tubes are formed in the top of the semiconductor substrate. Thesemiconductor substrate may further include a lightly doped epitaxiallayer from which the pillars 110 are formed. Alternatively, the pillars110 be formed of a lightly doped single crystal substrate without aninitial epitaxial layer, as is later disclosed.

In an exemplary embodiment, each of the N-type nano tubes has a width ofabout 0.25 microns and dopant concentration of about 2E12/cm² (for a pervolume concentration of 8E16/cm³) and most of the P-type nano tubes havea width of about 0.5 microns with a dopant concentration of about2E12/cm². However, the P-type nano-tube nearest the gap filler 120 has adopant concentration of about 1E12/cm². The P-type nano tube nearest tothe P-type pillars 110 has a width of about 0.5 microns and a dopantconcentration of about 8.5E11/cm². The surrounding P-type pillars 110have a width of about 1.5 microns and a dopant concentration of about1.5E11/cm² (between 2E14/cm3 to 1E15/cm³ as a per volume concentration).In this way P-type pillar 110 and the P-type tube closest to the P-typepillar 110 sum up for a combined dopant concentration of 1E12/cm². Eachof the P-type nano tubes and N-type nanotubes with a dopantconcentration of 2E12/cm² may be considered and conceptualized as twoadjacent halves, each half having a dopant concentration of 1E12/cm² toform a combined charge-balanced nano tube by integrating two surroundingnano tubes with complementary opposite and equal charges. With theexemplary dopant concentrations as described, the nano-tubes of oppositeelectrical conductivities are charge balanced with each other andfurther with the P-type columns 110, and achieve a super junctioneffect. Only a single unit cell 101 is shown in FIG. 2. FIG. 2-1 shows across section for a HV diode device 100 with multiple unit cells 101repeated one next to another throughout the semiconductor die. Thus withtwo of these unit cells 101 next to each other, adjacent P-type pillars110 combine for a cumulative width of about 3 microns, though each halfof the combined pillar structure still has a dopant concentration of1.5E11/cm² across 1.5 microns, so that the per volume dopantconcentration of the P-type pillars 110 is about 1E15/cm³. By way ofexample, the pillars may have a width of approximately half toone-fourth of a width of said trenches. FIG. 2-2 shows a perspectiveview of a unit cell 101, however without the P-implant top layer 130.FIG. 2A shows a perspective view of a unit cell 101, also without aP-implant top layer 130 with N-type pillars 110′.

The high voltage (HV) nano tube diode device 100 as shown in FIG. 2 canbe formed with many nano-tube N-channels and P-channels to reduce theresistance and achieve a low drain-to-source resistance (Rds). Forexample, a device with the N-type nano tubes having a width of 0.25micron and total 1E12/cm² dopant concentration, the resistance is aboutthe same as the Rds of a device with a channel that has a width of fivemicrons and having a dopant concentration of 1E12/cm². A conventionalsuper junction device may have a drain-to-source resistance Rds of about25-30 milliohms-cm2, the device implemented with ten nano tubes asdisclosed has an estimated Rds of about 2-4 Milliohms-cm2 for a 600V BV

The vertical junction structure shown in FIG. 2 can be implemented tomanufacture many different types of devices such as MOSFET, bipolarjunction transistor (BJT), diodes, junction field effect transistor(JFET), and insulated gate bipolar transistor (IGBT). The nano tubes maybe formed with thin epitaxial layers including P-layers having athickness approximately 0.5 microns doped with 0.6-0.8E12 cm-2 formednext to N-layers with a thickness of 0.25 to 0.5 microns dopedpreferably by Arsenic or Antimony in the range of about 1.6-2E12 cm-2.Then a P-type column of a width ranging from about 0.5 to 1 micro isformed that is doped in the range of 1.6E12 to 2E12/cm². These thinN-type and P-type columns are repeatedly formed in trenches until theselayers merge to the central part of the trenches. A dielectric or verylightly doped silicon gap filling layer 120 is then formed to fill thegap between the merging nano tube columns. As discussed above, thegap-filling layer can be grown oxide, deposited dielectric material, orintrinsic silicon.

The vertical super junction structure as disclosed in FIG. 2-1 andmanufactured by applying the processes described below is formed with awide P-type column/Pillar structure that is approximately 2 to 5 micronswide and lightly doped in a range of 0.1-0.2E12 cm-2 on a N++ substrate.Instead of using P-type Column/Pillar, these Pillars could be N-type byusing a lightly (2E14-1e15 cm-3) doped N-epi on N++ substrate as astarting material. An alternative configuration of the nano tubes isshown in FIG. 2A with N-type pillars 110′ between the trenches formed asN-type pillars 110′. The conductivity types of the pillars and of thenano tubes have been reversed, as compared to FIG. 2, but the substrate105 is still N-type, as are the N-type diffusion bottom and columnregions, 105-B and 105-C. The dopant concentrations are shown in FIG.2A-1, and are still charge balanced. The conductivity types,thicknesses, quantity and arrangement of the pillars and the N-type andP-type nano tubes may be reconfigured so long as they are still chargebalanced.

FIG. 2A-2 shows an alternative embodiment 100′ of the invention similarto FIG. 2A-1, but in which the center of the trench is filled with acenter nano tube 115′ rather than an insulating gap fill. This centernano tube 115 may be epitaxially grown to completely fill the remaininggap between the surrounding nano tubes. In the example shown here, thecenter nano tube 115′ has a thickness of about 1 micron and a dopingconcentration of about 2E12/cm², and achieves charge balance with thesurrounding nano tubes. This embodiment may be more difficult tomanufacture because of tolerance, charge balance, and gap fill issues.

Various structures may be formed on the top surface that run ninetydegrees to the P and N type columns, as will be illustrated below; thecross section of these structures can be seen on the plane 111 of FIG.2A, as will be shown in further embodiments. In an exemplary embodimentshown in FIG. 2B, an N+ type surface layer 130′ is electricallyconnected to all the N-type columns. The top surface layer 130′ may beimplanted or grown. In another exemplary embodiment, the device furthercomprises a vertical planar MOSFET formed with a planar polysilicon gate150 padded by a gate oxide layer 155 extended along an orientation thatis ninety degrees from the P and N type columns with P− body regions 160encompassing N+ source regions 170 and having a P+ body contact region180 formed near the top surface between the source regions 170 as shownin FIG. 2C. The N+ substrate 105 acts as the drain for the MOSFET. TheMOSFET structure of FIG. 2C is superimposed on the plane 111 of FIG. 2A.FIG. 2D shows another exemplary embodiment similar to FIG. 2C exceptthat there is a N-type surface layer 130′ electrically connected to allthe N-type columns 115-N. Shorting the n-type columns 115-N togetherwith the N-type surface layer 130′ may help reduce Rds, and lowerspreading resistance. Similar to FIG. 2C, the device of FIG. 2D alsocomprises a vertical planar MOSFET formed along an orientation that isninety degrees from the P and N type columns where all the P columns115-P are electrically connected to the P-body regions 160. The N-typenano tubes 115-N and the N-type pillars 110′ are connected to the N-typesurface layer 130′ and act as the super junction drift region. FIG. 2Eshows another exemplary embodiment that further includes a Schottkymetal 131 disposed on the top surface for contacting all N-columns115-N. P+ ohmic contact regions 181 may optionally be included toprovide ohmic contact between the P columns 115-P and the Schottky metal131. FIG. 2E-1 shows the same embodiment as FIG. 2E, except with theSchottky metal 131 removed to show the underlying structures. FIG. 2E-2is the same as FIG. 2E-1, except that gap filler 120 in FIG. 2E-2 ismade from an oxide, rather than lowly doped (intrinsic) silicon. FIG. 2Fshows another embodiment of this invention wherein the device furtherhas P+ type substrate 105′ with N-type buffer layers 105-B′ and 105-Cbeneath the P columns 115-P and N columns 115-N and the N-type pillars110′ to form an IGBT device. The IGBT device also includes a planar gate191, an N+ emitter/source region 192, P− body region 193, P+ bodycontact 194, and gate oxide 195. The P+ substrate 105′ acts as thecollector. FIG. 2F-1 shows a similar IGBT device, but one with gatetrenches 191′, rather than planar gates. FIGS. 2G-2H show additionalembodiments in which various device structures are formed on the plane111 of FIG. 2A along an orientation that is ninety degrees from the Pand N type columns 115-P and 115-N. FIG. 2G shows a junction fieldeffect transistor (JFET) as it would appear on the plane 111 of FIG. 2A,wherein the device further includes P type gate region 151, N+ sourcecontact region 152, and N− region 153 to form a JFET device. The N+substrate 105 acts as the drain. FIG. 2H shows bipolar junctiontransistor (BJT) wherein the device further includes a N+ emitter region161 and a P-type base region 162 to form a BJT device. The N+ substrate105 functions as the collector.

FIG. 2I shows another exemplary embodiment wherein the device furthercomprises a trench MOSFET formed with a trench polysilicon gate 150′padded by a gate oxide layer 155 extended along an orientation that isninety degrees from the P and N type columns with P− body regions 160encompassing N+ source regions 170 and having a P+ body contact region180 formed near the top surface between the source regions 170. N+substrate 105 acts as the drain. FIG. 2J shows another exemplaryembodiment similar to FIG. 2I wherein the beginnings of a gate pad 150″is formed on top of a field oxide layer 165. Similar to FIG. 2I, thedevice further comprises a trench MOSFET formed along an orientationthat is ninety degrees from the P and N type columns where all the Pcolumns are electrically connected to the P-body regions 160.

Referring to FIGS. 3A to 3E for a serial of side cross sectional viewsto illustrate the fabrication steps of a semiconductor power deviceimplemented with nano tubes as that shown in FIG. 2. FIG. 3A shows astarting N+ red phosphorous silicon substrate 205, i.e., a heavily N+doped silicon substrate, supports a P-type epitaxial layer 210 that hasa thickness of approximately 40 micrometers with a P-dopantconcentration of approximately 1e15/cm³. In FIGS. 3B-1 and 3B-2, anetching process is carried out to open the trenches 212-1 and 212-2. Thetrenches have a width of about 10 microns with P-pillars 210-P having apillar width of about 3 microns (by way of example the pillar width mayvary about from two to five microns). The sidewalls of the trenches212-1 and 212-2 may have a slightly tilted angles β such as 85-88degrees (the tilt angle would be 2-5 degrees measured from a verticalaxis) instead of a near perpendicular pillars, e.g., pillars ofapproximately 89 or 90 degrees, since the tilted angles of the sidewallsand the pillars 210-P would not have significant impact on theperformance of charge balance.

In FIG. 3C, alternating thin layers of N epitaxial layers 215-N and Pepitaxial layers 215-P are grown covering the trench sidewalls and thetop surface area surrounding the trenches 212-1 and 212-2. A small gapis left near the central portion of the trench after completing thegrowth of multiple N-epitaxial layers 215-N adjacent to the P-epitaxiallayers 215-P. The small central gap is filled with a thermally grown ora deposition of an insulative gap filler 220. In FIG. 3D, a chemicalmechanical planarization (CMP) process is carried out to remove the topsurface above the P-pillars 210-P and above the top surface of thetrenches. In FIG. 3E, a N-diffusion process is carried out by applyingan elevated temperature to diffuse the heavily doped N-dopant ions fromthe N+ substrate 205, which in this example may be a diffusion of about5 microns, into the bottom portion of the trenches covering withepitaxial layers and into the bottom portion of the P pillars 210-P toform the N+ diffusion bottom region 205-B and N+ diffusion column region205-C. This diffusion changes the remaining portions of the N and Pepitaxial layers 215-N, 215-P into vertical nano tubes. If the chargeconcentrations of these N and P epitaxial layers 215-N, 215-P, andpillars 210-P are chosen correctly, as shown in FIG. 2, charge balanceis achieved, and these vertical nano tubes can be used for superjunction applications. The aspect ratio of the diffusion process asshown in FIG. 3E is more realistic than the representations shown inFIG. 2.

A P implant may be carried out to form a top P+ region on the topsurface of the substrate to form a high voltage vertical diode, like theone shown in FIG. 2.

An alternative method is shown starting from FIG. 3F which may aid thediffusion process. It uses the same first steps as shown in FIG. 3A and3B-1. However as shown in FIG. 3F, after forming a few N and P epitaxiallayers 215-N and 215-P, the epitaxial growth steps are paused, and avertical (anisotropic) N+ implant 251 is performed to form N+ regions250 in the exposed epitaxial layers 215-N and 215-P as shown in FIG. 3G.An oxide layer (not shown) may first be grown to protect the sidewallsduring the implanting process, and removed afterwards. In FIG. 3H, therest of the N and P type epitaxial layers 215-N and 215-P are grown asusual, along with the gap fill 220. A CMP process is carried out toremove the excess top material, as shown in FIG. 3I. During thediffusion process of FIG. 3J, the N+ region 250 may aid in the formationof N+ diffusion bottom region 205-B, and N+ diffusion column regions205-C.

FIG. 4 shows an alternative configuration of a unit cell 301 havingcharge balanced alternating N and P nano tubes 315-N and 315-Psurrounded by N− pillars 310, having a dielectric gap-filling layer 320in the center supported on a N++ substrate 305. There is also a N+diffusion bottom region 305-B and N+ diffusion column region 305-C overthe substrate 305. This simplified nano tube configuration may besimpler to manufacture than those shown above. By way of example, thewidths and dopant concentrations of the N and P nano tubes 315-N and315-P and the N− pillars 310 are shown in the FIG. 4. The nano tubes andthe pillars are charge balanced for the embodiments shown in FIG. 4, andalso for the embodiments shown in FIGS. 2 through 3. FIG. 4A shows theactive area 390 of a semiconductor power device 300 using the nano tubeunit cell 301 configuration of FIG. 4. In this example the power device300 is a trench MOSFET (similar to those in FIG. 2I) located. The trenchMOSFET is formed with a trench polysilicon gate 350 padded by a gateoxide layer 355 extended along an orientation that is ninety degreesfrom the P and N type columns 315-P and 315-N with P− body regions 360encompassing N+ source regions 370 and having a P+ body contact region380 formed near the top surface between the source regions 370. N+substrate 305 acts as the drain.

Referring to FIG. 4A-1 through FIG. 6 for the configuration of atermination area 399 of a semiconductor power device 300 that isspecifically implemented in this exemplary embodiment as a MOSFET. FIG.4A-1 shows a top view of the layout of semiconductor device 300. Theactive area 390 occupies the middle portion of the power device 300.Within the active area 390 are the portions of source metal 350-I, andgate metal 350-G forming the source pads and gate pad. Other portions ofthe power device 300 may be covered with a passivation layer 302.Outside of the active area is the termination area 399. The terminationarea 399 forms a ring around the active area, near the edges of thepower device 300. The drain is on the bottom side and is not visiblefrom the top.

FIG. 4B shows a close-up cross sectional view of a termination area 399of the semiconductor power device 300 of FIG. 4A-1 implemented with thevertical nano-tubes structure as that described in FIGS. 4 to 4A aboveto achieve a high breakdown voltage for the semiconductor power device300. The nano tubes are still charge balanced to achieve the highbreakdown voltage. The passivation layer is not shown in FIG. 4B forsimplicity. FIG. 4B shows the cross section of the beginning of thetermination region. The semiconductor power device 300 is supported on aheavily doped N type substrate shown as a red phosphorous substrate N++layer 305. The bottom of the nano-tube structure further includes a N+diffusion layer 305-B and the bottom of the N− pillars 310 have a N+column diffusion layer 305-C which may be formed by a diffusion processof the N++ red phosphorous substrate 305 as described above. Thesemiconductor power device further includes a plurality of N-type thinepitaxial layers 315-N and P-type thin epitaxial layers 315-P. Thesenano-tubes are formed as alternating N-epitaxial layers 315-Nimmediately next to a P-epitaxial layer 315-P between N-type pillars 310as vertical nano-tubes extended from a top surface of the substratecovered by an oxide insulation layer 330 to the bottom N+ region 305-Band N+ substrate 305. The nano-tube structure further includes a centralgap fill (lightly doped silicon or a dielectric) 320 formedsubstantially in the center between the N-type and P-type nano tubes315-N and 315-P. The semiconductor power device 300 further includesP-body regions 340 formed on the top portion of the nano-tube structure.The semiconductor power device 300 further includes a plurality ofpolysilicon field plates 345 electrically connected to the P+-regions340 via a top metal layer 350 with the innermost metal layer 350-I alsoelectrically connected to a source region of the semiconductor powerdevice and the other metal layers 350 function as floating metals. TheP+ regions 340 short together the P-type nano tubes 315-P. The innermostmetal layer 350-I is generally implemented to operate at a zero volt,while as an exemplary embodiment; each successive floating metal layer350 may be implemented to sustain a voltage of approximately fiftyvolts. Each nano tube termination group forms a ring 398 around theactive area 390. Two such groups and the beginning of a third are shownin FIG. 4B. The basic structure of each nano tube group (not includingthe P+ region 340, oxide 330, polysilicon field plate 345, and floatingmetal 350) is the same as those of the unit cells 301 in the active area390, and are formed at the same time.

FIG. 5 is a cross sectional view to illustrate the entire terminationarea 399 of a semiconductor power device 300 implemented with thenano-tube structure shown in FIGS. 4 to 4B. By increasing the number ofthe nano tube super-junction rings 398 and by adjusting the dopantconcentrations of the N-region 360 and the voltage of the field plates345, and the 2 step field plates 346. After the last field ring, a finaltermination structure 397 is formed including 2 step field plates 346formed to reduce the surface field by using polysilicon and metalcombination; also field plates region 346 are formed and electricallyconnected to Scribe line (where sawing will take place) to stopdepletion reaching to die edge after the sawing. There is also a N+channel stop 370 at the die edge. The termination area 399 is able tosustain a break down voltage up to 760 volts with ten rings of thenano-tube super junction structures as shown in FIG. 5 and the final 2step field plates 346 edge structure. A passivation layer 380 is showncovering most of the termination area 399.

FIG. 6 is cross sectional view of a termination area 399′ withalternative field plate design in the final termination structure 397′;three steps instead of two steps for forming field plates 346′ (insteadof 346) as that described for FIG. 5. These field plates 346′ are formedby combination of thermally grown oxide layers, polysilicon, depositedoxide (borophosphosilicate glass (BPSG) or tetraethyl orthosilicate(TEOS)) and metal layers, and may be more capable than the finaltermination structure 397 of FIG. 5, but requires and extra step tomake.

FIG. 6A is a cross sectional view of an alternative terminationstructure 399″. This structure is formed by using wider trenches (widerthan active area trenches) to leave wide gaps after the epi growthprocess. Unit cells 301′ are formed in the trenches, which are similarin structure to the unit cells 301 (FIG. 4) of the active area, and maybe formed at the same time using the same steps, but have a wider gap inthe middle. Pillars and adjacent nano tubes form silicon island rings361 surrounded with 2-5 microns gaps substantially filled with adielectric material 362 and having floating P-regions 363 at the topsurfaces. The floating P-regions bridge the p-type nano tubes across then type nano tubes and pillars.

These silicon island rings 361 separated by dielectric material 362constitute a floating capacitor 366 network which divides the voltageamongst the floating P-regions 363 based on their equivalent capacitancevalues. In another words, high voltage termination for this inventioncan be implemented by using trench capacitors 366 separated by siliconside wall electrodes. By way of example the wide gaps 362 can be filledwith oxide and silicon Oxide with Poly Silicon mixture (SIPOS) to reducestress from thick SiO2 thus prevent cracking. Termination trenches canbe formed after the MOSFET/active device processing before metallizationby etching and epitaxial filling or as part of active area trench etchand epi fill process.

Although the termination regions 399 and 399′ of FIGS. 4B-6 use the nanotube unit cell 301 configuration of FIG. 4, the same principle can beapplied to other charge balanced nano tube configurations such as theones disclosed in FIGS. 2 through 3.

FIGS. 7A to 7D are a serial of cross sectional views for illustratingalternate manufacturing processes for making a semiconductor powerdevice of this invention. The nano-tubes comprising N-columns 315-N andP-columns 315-P are formed in a single, lightly doped N-type siliconsubstrate 305′ without an epitaxial layer. This structure is similar tothat seen in FIGS. 2 through 3, but without an initial epitaxial layerto form the pillars. Instead the nano tubes are formed in a lightlydoped single crystal substrate. In FIG. 7B, MOSFET cells are formed onthe top surface with body regions 343 encompassing source regions 341surrounding the trench gates 342. In FIG. 7B-1 a dielectric layer 364(BPSG or TEOS) is deposited to protect the top surface during thesubsequent process steps such as backside grinding. In FIG. 7C, thebottom of the substrate 305 is ground off. In FIG. 7D, N and N+ regions310-1 and 310-2 are implanted, deposited or epitaxially grown at thebottom of the substrate 305. The N region 310-1 merges the bottoms ofthe nano-tubes and pillars together and is the nano tube merger region.If the layers are not highly doped, growing works better. For supportingan IGBT device as shown in FIG. 2F, the regions 310-1 and 310-2 can beformed as a N-buffer and P+ layer, respectively. After the backside N++layer for MOSFETs (N-buffer and P+ layers for IGBT), the top surfacedielectric layer 364 may be patterned as shown in FIG. 7E, and the restof the top side processes (e.g., metal, passivation) may be completed.Alternatively, if the backside processes may be performed at a lowenough temperature, the top side processes may be completed beforeperforming the backside processes.

FIGS. 8A to 8C are a serial of cross sectional views for themanufacturing processes to resolve the difficulties of void formationduring a gap filling process. In FIG. 8A, the trenches 308 are formed ina N− epitaxial layer 310 over a N++ substrate 305 with a large tiltangle θ with respect to the vertical axis. By way of example the tiltangle θ may be 2-5 degrees (85-88 degrees measured relative to thebottom surface of the trenches 308). In FIG. 8B, a plurality of N-dopedepitaxial layers 315-N and P-doped epitaxial layers 315-P are growncovering the sidewalls and bottom surface of the trenches 308. A middleportion remains with angular gap 308′. The top portions of the epitaxiallayers, which will soon be removed by CMP process is not shown forsimplicity. In FIG. 8C, the middle gap 308′ is filled with a gap filllayer 320 which can be oxide or intrinsic silicon or other types ofdielectric material. The gap filling process can be more convenientlycarried out because of the tilt angular configuration thus resolving thedifficulties of void formation when filling the gap between the dopednano-tubes. FIG. 8D illustrates a potential void formation problem forthe gap filling process if the sidewalls are too vertical; this problemis compounded when the gap is narrow.

FIGS. 8E-8G show alternative embodiments of the present invention byusing trenches and pillars with varying widths to improve the gapfilling process after the epi growth. In FIG. 8E, the trench has a angleplus steps to vary the width of the trench. In this case, the tilt angleθ of the trench does not need to be as large. The trench might even bevertical, with steps to change the width of the trench, and ease the gapfilling process. Trench width can be modified step by step by using atrench etch step combined with spacer as shown in FIGS. 8F-8G. In FIG.8F, part of the trench is etched. In FIG. 8G, spacers are formed on thesidewalls and another portion of the trench is etched to form a step inthe trench. By way of example, one third of the depth of the trench maybe first etched, then a spacer may be formed in the range of 0.1 to 1micron thickness. Then using spacer the rest of the trench may be etchedto form a two step pillar (and trench). By adding one more spacer andetch process, a pillar with three different widths may be formed. Thespacer may be formed from an oxide, nitride, or a combination of the two(or an equivalent material).

FIG. 9A is a top view for showing the closed cell configuration thatincludes a plurality of the nano tube unit cells 401 in an active area490 disposed substantially in the middle portion of a semiconductorsubstrate. Each nano tube unit cell 401 comprises concentric alternatingrings of N and P type columns 415-N and 415-P surrounded by N-typepillars 410, and with a gap filler 420 in the center. The cross sectionconfiguration of the unit cell 401 is similar to that of unit cell 301in FIG. 4. The substrate is formed with a plurality of nano-tubesfilling in a plurality of trenches opened in the substrate/epitaxiallayer as shown in FIGS. 2 through 8 above. The unit cells may takevarious shapes and orientations within a semiconductor die, but theoverall width ‘w’ of the nanotubes portion of each unit cell shouldremain relatively the same within the same semiconductor die. The widthof the pillar regions 410 may be more flexible if it is lowly dopedsince it will not affect the charge balance very much. The semiconductorpower device further includes a termination area 499 (not to scale) thatforms a ring around the active area 490 out to the die edge 491 and hasa plurality of nano-tube columns to support high voltage applications asthat illustrated in FIGS. 4 through 6 above. This figure is not toscale, but only gives an idea as to the relative positions of thevarious structures. The detailed structure of the termination area isalso not shown in FIG. 9A, but may be similar to the termination area399, 399′ in FIGS. 4-6.

FIG. 9B-1 shows a top view for showing a first termination ring 498 ofthe termination area 499 of a semiconductor device. The termination ringhas a similar basic structure as the unit cells 401. The terminationring 498 can be seen circling the active area 490. The rest of thetermination rings 498 are out of the boundaries of FIG. 9B-1. FIG. 9Bshows an alternative staggered rectangular shape for the unit cells 401in the active area. FIG. 9C shows an alternative hexagonal shape for theunit cells 401.

Although the present invention has been described in terms of thepresently preferred embodiment, it is to be understood that suchdisclosure is not to be interpreted as limiting. For example, though theabove describes an n-channel device, this invention can be applied top-channel devices as well simply by reversing the conductivity types ofthe doped regions. For example, the substrate and the nano tube mergerregions may be P-type rather than N-type. Various alterations andmodifications will no doubt become apparent to those skilled in the artafter reading the above disclosure. Accordingly, it is intended that theappended claims be interpreted as covering all alterations andmodifications as fall within the true spirit and scope of the invention.

1. A method for manufacturing a semiconductor power device of on asemiconductor substrate comprising: opening a plurality of deep trenchesbetween lightly doped pillars and substantially filling the deep trenchwith alternating N and P doped multiple epitaxial layers overflowing andcovering a top surface of the semiconductor substrate with a topepitaxial layer wherein the epitaxial layers form charge balanced nanotubes for functioning as conducting channels extending along a sidewalldirection; filling a remaining central gap with a gap filler; and saidstep of forming nano tube merger regions further comprises diffusingdopants from a bottom substrate region.
 2. The method of claim 1wherein: said step of filling said central gap with said gap fillerfurther comprising a step of forming said gap filler as a lightly dopedsilicon with a dopant concentration equal to or less than 10% of adopant concentration of adjacent nano tubes.
 3. The method of claim 1wherein: said step of filling said central gap with said gap fillerfurther comprising a step of forming an oxide layer to fill said centralgap.
 4. The method of claim 1 wherein: said step of filling said centralgap with said gap filler further comprising a step of depositing adielectric layer in said central gap.
 5. The method of claim 1 furthercomprising: removing the epitaxial layer from a top surface down tooriginal Pillar surface by a CMP (Chemical Mechanical Polishing) processand growing an N-epitaxial layer with a thickness substantially between1 to 5 microns.
 6. The method of claim 1 further comprising a step of:forming nano tube merger regions at the bottom of the multiple epitaxiallayers and pillars to merge together the nano tubes and to connect thebottoms of the nano tubes to a bottom substrate region.
 7. The method ofclaim 1 wherein: said step of opening a plurality of deep trenches isperformed on the top of a bottom substrate with a lightly dopedepitaxial layer on top.
 8. The semiconductor power device of claim 1wherein: said step of opening a plurality of deep trenches is performedon the top of a single crystal semiconductor substrate.
 9. A method formanufacturing a semiconductor power device of on a semiconductorsubstrate comprising: opening a plurality of deep trenches betweenlightly doped pillars and substantially filling the deep trench withalternating N and P doped multiple epitaxial layers overflowing andcovering a top surface of the semiconductor substrate with a topepitaxial layer wherein the epitaxial layers form charge balanced nanotubes for functioning as conducting channels extending along a sidewalldirection; filling a remaining central gap with a gap filler; said stepof opening a plurality of deep trenches is performed on the top of asingle crystal semiconductor substrate; and backgrinding the back sideof the substrate and then forming the bottom of the semiconductor powerdevice.
 10. The semiconductor power device of claim 1 wherein: said stepof opening said trenches between said pillar columns further comprisesopening said trenches having sidewalls formed with a slightly tilt anglerelative to a vertical direction to ease gap filling.
 11. A method formanufacturing a semiconductor power device of on a semiconductorsubstrate comprising: opening a plurality of deep trenches betweenlightly doped pillars and substantially filling the deep trench withalternating N and P doped multiple epitaxial layers overflowing andcovering a top surface of the semiconductor substrate with a topepitaxial layer wherein the epitaxial layers form charge balanced nanotubes for functioning as conducting channels extending along a sidewalldirection; filling a remaining central gap with a gap filler; and saidstep of opening said trenches between said pillar columns furthercomprising opening trenches with multiple widths having steps.
 12. Amethod for manufacturing a semiconductor power device of on asemiconductor substrate comprising: opening a plurality of deep trenchesbetween lightly doped pillars and substantially filling the deep trenchwith alternating N and P doped multiple epitaxial layers overflowing andcovering a top surface of the semiconductor substrate with a topepitaxial layer wherein the epitaxial layers form charge balanced nanotubes for functioning as conducting channels extending along a sidewalldirection; filling a remaining central gap with a gap filler; said stepof opening a plurality of deep trenches is performed on the top of asingle crystal semiconductor substrate; and backgrinding a back side ofthe semiconductor substrate followed by performing an ion implantationand a rapid thermal annealing (RTA).
 13. A method for manufacturing asemiconductor power device of on a semiconductor substrate comprising:opening a plurality of deep trenches between lightly doped pillars andsubstantially filling the deep trench with alternating N and P dopedmultiple epitaxial layers overflowing and covering a top surface of thesemiconductor substrate with a top epitaxial layer wherein the epitaxiallayers form charge balanced nano tubes for functioning as conductingchannels extending along a sidewall direction; filling a remainingcentral gap with a gap filler; said step of opening a plurality of deeptrenches is performed on the top of a single crystal semiconductorsubstrate; and backgrinding a back side of the semiconductor substratefollowed by performing an epitaxial growth.